Lightmatter, the leader in photonic (super)computing, today announced Passage™ L200, the world’s first 3D co-packaged optics (CPO) product. Designed to integrate with the latest XPU and switch silicon ...

Lightmatter turbocharges GPU connectivity with its first photonics-based networking interconnects - SiliconANGLE ...

AI workloads are rapidly increasing, driving the need for higher bandwidth, lower latency, and more power-efficient optical interconnects. Broadcom is meeting these evolving demands with a ...

Broadcom (AVGO) announced the expansion of its portfolio of optical interconnect solutions to enable AI infrastructure. These innovative ...

Increasingly sophisticated AI models are driving an unprecedented surge in demand for compute and memory performance, ...

We recently published a list of 12 AI News and Analyst Ratings You Probably Missed. In this article, we are going to take a ...

Together, Nubis and Samtec are supporting a new category: CPX, which is a common, interoperable footprint for co-packaged copper and optics. The massive growth of AI models for training as well as ...

Chiplets are the only viable solution to maintain the annual cadence of hardware upgrades that AI scaling demands.

As the Ethernet Alliance's 10th anniversary Ethernet roadmap spells out massive opportunities for high-speed, scalable ...

Following Nvidia's (NVDA) recent announcement at GTC 2025 that it plans to scale artificial intelligence factories with ...