The Commercial Times reports that TSMC is set to begin taking orders for wafers built on its 2nm N2 node process next week. The semiconductor giant ...

UBS says Intel's near-term focus includes landing major chip clients and rolling out a lower-power 18A process ...

Intel’s upcoming product roadmap outlines a detailed plan for its next-generation processors and advanced process nodes.

At the company’s AP8 facility, which mainly focuses on expanding CoWoS (Chip-on-Wafer-on-Substrate) capacity, new equipment ...

Comment As Jensen Huang is fond of saying, Moore's Law is dead – and at Nvidia GTC this month, the GPU-slinger's chief exec ...

Intel's bloated workforce and foundry struggles require it to overcome years of poor execution. Read why INTC stock is ...

In addition to supplying equipment used in CoWoS technology, Gallant Micro is developing equipment to be used in next-generation chip packaging technology, square panel-level packaging (PLP) ...

SPONSORED CONTENT  Consider, for a moment, the current state of AI accelerators and datacenter GPUs. Now, try to imagine this ...