Tata Electronics said Ang will drive manufacturing operations at the Dholera fab unit which is making ‘steady progress ...

One of the biggest advantages of this approach, Lightmatter says, is that communications between chips aren't limited to a so ...

Kevin O'Buckley, senior vice president and general manager of Intel Foundry Services, confirmed that risk production has ...

The computing system that Cerebras is building for DARPA will also feature “wafer scale co-packaged optics” from Ranovus. According to Reuters, the latter technology will be used to link together ...

View the full release here: "By combining wafer scale technology and co-packaged optics interconnects, Cerebras will deliver ...

The silicon photonics startup has announced new products to tackle interconnect bottlenecks costing enterprises millions in ...

The race beyond silicon is already underway. As these emerging semiconductor materials become more viable, they will enable ...

Aixtron SE will supply Nokia with its G10-AsP system to enable the company to produce 6-inch InP wafers, marking the next ...

Huawei cut ties with Android for good with the launch of its sideways-flip Pura X earlier this month. After betting big on ...

Samsung Foundry's low yield is costing it customers. Google switched to TSMC for its Tensor G5 application processor (AP) for ...

U.S. IC chemicals and materials; China export blacklist expands; global fab equipment report; high-density 3D DRAM; ...