Tata Electronics said Ang will drive manufacturing operations at the Dholera fab unit which is making ‘steady progress ...
One of the biggest advantages of this approach, Lightmatter says, is that communications between chips aren't limited to a so ...
Kevin O'Buckley, senior vice president and general manager of Intel Foundry Services, confirmed that risk production has ...
The computing system that Cerebras is building for DARPA will also feature “wafer scale co-packaged optics” from Ranovus. According to Reuters, the latter technology will be used to link together ...
View the full release here: "By combining wafer scale technology and co-packaged optics interconnects, Cerebras will deliver ...
The silicon photonics startup has announced new products to tackle interconnect bottlenecks costing enterprises millions in ...
The race beyond silicon is already underway. As these emerging semiconductor materials become more viable, they will enable ...
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