The Silicon Valley-headquartered quantum computing start-up is heavily backed by the federal and Queensland governments, and ...
More and better screening of diced dies is essential to meet the quality and cost goals of the 2.5D/3D-IC era.
Researchers demonstrate scalable integration of graphene and GaN devices using van der Waals forces, enabling high-performance CMOS-compatible electronics.
POSTECH and University of Montpellier researchers demonstrate wafer-scale AA-stacked hexagonal boron nitride (hBN) growth.
Pohang University and University of Montpellier researchers synthesize AA-stacked hBN, revealing novel stacking control ...
A schematic overview of a planar n-type MOSFET ... The transistors on microchips are made by building up layers of interconnected patterns on a silicon wafer. This manufacturing process is a highly ...
Corning Incorporated ( NYSE: GLW) Investor Event Conference Call March 18, 2025 8:45 AM ET ...
The Peking team has fabricated what the paper describes as a "wafer-scale multi-layer-stacked ... Below is Samsung's ...