Semiconductor Engineering14d
The Rise Of Thin Wafer Processing
From thinning and trimming to bonding and debonding, 3D package quality is built on precise and extremely thin wafer ...
Which has higher hardness compared to aluminum nitride ceramics and silicon carbide ceramics
Aluminum nitride (AlN) and silicon carbide (SiC) are both high-performance engineering ceramic materials, but there is a ...
OpenLight Partners with TFC to Fast-track the Silicon Photonics Back-end Process for Semiconductor Production and Optical Communication Systems
OpenLight, the world leader in custom PASIC chip design and manufacturing, today announced a new ecosystem partnership with ...
Morningstar3d
OpenLight Partners with TFC to Fast-track the Silicon Photonics Back-end Process for Semiconductor Production and Optical Communication Systems
As silicon photonics adoption grows ... completed wafers and provide back-end processes, including wafer-level bumping, testing, grinding, and dicing to deliver known-good dies.
Yicai Global20d
The proposed acquisition of 70% equity of DGT is conducive to the extension of the industrial chain
DGT's proprietary technology is a precision machining technology for high-quality quartz and silicon parts for etching materials, which uses advanced machining equipment and technology to carry out ...
PV Tech3d
Gstar receives PV wafer equipment at 3GW plant in Indonesia
Gstar Solar has received solar equipment - monocrystalline growth furnaces - for its 3GW wafer manufacturing plant in ...
Yahoo Finance14d
Semiconductor Wafer Polishing & Grinding Equipment: 2025-2030 Industry Forecast Report
Dublin, March 20, 2025 (GLOBE NEWSWIRE) -- The "Semiconductor Wafer Polishing & Grinding Equipment Market by Equipment Type (Grinding Equipment, Polishing Equipment), Wafer Size (200 mm Wafers ...