Markets calling for ultrathin wafers are growing. The combined thickness of an HBM module with 12 DRAM dies and a base logic chip is still less than that of a prime silicon wafer ... Bonding takes ...

The chip maker is reportedly producing initial runs of its most advanced chips ever produced, the 18A wafers ... stars in Silicon Valley? Nominate them for our annual 40 Under 40 special editorial ...

The unlisted Tata group entity ventured into chip manufacturing under the Centre’s India ... manufacture data processing chips out of silicon wafers. Chip fabs are typically among the world ...

OpenLight’s PASIC technology integrates all the components of silicon photonics devices, both active and passive components, into one chip ... s business is included under the heading ...

Credit: Yilin Wong Hundreds of regular patterns spontaneously emerge on a small germanium chip ... of a germanium wafer topped with evaporated metal films in contact with a drop of water. On a whim, ...

ASMPT, as a leader of advanced package technology, boasts its TCB technology, which gradually evolves from chip to substrate (C2S) and from chip to wafer ... forces under the AI wave. Zhunxin ...

A team of engineers at Fudan University has successfully designed, built and run a 32-bit RISC-V microprocessor that uses ...

The innovative device operates 40% faster than Intel and TSMC's cutting-edge three-nanometer silicon chips, while consuming 10% less energy ... Notably, all the comparisons were made under the same ...