Think microchips can’t get any thinner? Think again! Thin discs help make devices faster, lighter, and more efficient. These super-thin chips improve performance while using less power, paving the way ...

The integration and miniaturization of amplifiers and oscillators, crucial for modern electronics, are achieved through ...

The EU Packaging and Packaging Waste Regulation (PPWR) aims to make the packaging industry more sustainable and to reduce the ...

Samples are available now, with bare die available immediately and an evaluation board including a integrated flip-chip 1.6Tb ...

Active interposers with transistors will gradually replace passive interposers, driving the transition to vertical stacking.

Texas Instruments (TI) has announced new power chips to support the rapidly growing power needs of modern data centres, which ...

In this rapidly growing digital era, advancements in analog layout design are shaping the future of 5G technology, enhancing ...

TI unveils the first 48-V integrated hot-swap eFuse and a new family of integrated GaN power stages in TOLL packaging.

Advanced Circuit & Packaging, DuPont. "As a leader in advanced interconnect technology, our expertise and broad product portfolio positions us to enable the increasing needs for device ...

Abstract: This paper presents a highly integrated and compact hybrid wireless power transfer (WPT) system with asymmetrical printed-circuit-board (PCB) based self-resonators. The PCB-based ...