News

Through our partnership with Intel, we are very proud to say that we have delivered the world’s first embedded FPGA (eFPGA) technology on their cutting-edge 18A process node. Now, ASIC and SoC ...
MINNEAPOLIS, May 15, 2025 — Perforce Software, the DevOps company for global teams seeking AI innovation at scale, is partnering with Siemens Digital Industries Software to transform how smart, ...
The European Union and Japan formalized their quantum technology partnership on Tuesday in Tokyo, with EU executive vice-president Henna Virkkunen and Japanese minister Minoru Kiuchi signing a letter ...
TNO and imec already collaborate within the Holst Centre, also located at the High Tech Campus Eindhoven; the Photonics Lab builds on this collaboration.
Electronic design firm Synopsys announced Wednesday it has expanded its strategic partnership with TSMC, enabling optimized design work on its latest A16 and N2P processes. A16 is TSMC’s latest ...
CAMPBELL, Calif., May 13, 2025 -- Arteris, Inc. (Nasdaq: AIP), a leading provider of system IP which accelerates system-on-chip (SoC) creation, today announced financial results for the first quarter ...
With the chiplet architecture gaining momentum as a modular and scalable alternative to traditional monolithic SoCs, Secafy is leveraging Menta's eFPGA IP to add post-silicon flexibility, ...
Synopsys’ General-Purpose I/O (GPIO) Library IP provides designers with the input/output operation, functionality, and reliability required for their SoCs targeting mobile, automotive, and ...
Single Port Register File compiler - TSMC 90 nm uLL - Memory optimized for high density and speed - Dual Voltage - Compiler range up to 40 kbits View Single Port Register File compiler - Memory ...
Mobiveil’s PCIe Gen3 to SRIO Gen3 Bridge is a high-performance FPGA-based protocol conversion IP that enables seamless communication between PCI Express (PCIe) and Serial RapidIO (SRIO) systems.
The primary objective of the 5G-OT Alliance is to expedite the adoption of private 5G and LTE networks in OT environments. By fostering collaboration, empowering innovation, and driving market ...
Abstract: Deep sub-micron effects complicate design closure for very large designs. Top-down hierarchical design methodology combined with physical prototyping increases design productivity and ...