Chiplets are emerging as a significant new phase in the evolution of the semiconductor market, providing a way to continue ...

Manufacturers are turning to automation, AI, and robotics to boost repeatability, cut costs, and support heterogeneous ...

Improved Package Internal Connections: Instead of traditional aluminum wedge bond, utilizing aluminum ribbon bonds, copper ...

Publication citation: C. -H. Lai, W. -J. Yin, W. -H. Lai, C. -L. Kao, C. -C. Wang and C. Hung, “Fine-Line RDL Structure ...

Breakthrough approach delivers better scaling and power efficiency, but at the cost of new processes like wafer thinning, bonding, and advanced debug.

We have arrived at the age where atomic level precision in the fabrication of semiconductor devices is needed to keep improving PPA. Thus, advanced film fabrication techniques that provide precise ...