The surface mount technology (SMT) reflow soldering process for electronic modules with ‘multi-variety, small-batch, variable states' faces significant challenges in achieving agility, low cost, and ...

If PCBs aren’t tested, errors and defects missed during the manufacturing process could eventually lead to malfunctions and product failures in the field. After a PCB board is manufactured and ...

The need for more input/output (I/O) connections was a big driver in package evolution. Think about it: a chip with a million ...

A Lean solution for high-mix production environments.

Watch This Mini Soldering Iron Reach 1000°C—Made with Batteries ...

Ryan] purchased a large fume extractor designed to sit on the floor below the work area and pull solder fumes down into its ...

Built a 1000°C Mini Soldering Iron Using Just Ordinary Batteries!

Indium Corporation principal engineer, advanced materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for ... assembly and packaging, as well ...

Nine broad use categories are classified for electronic assemblies which are subjected to varying thermal environments during their operational life, and worst-case, but realistic, temperature ...

Among the key goals of structural DNA nanotechnology are to build highly ordered structures self-assembled from individual DNA motifs in 1D, 2D, and finally 3D. All three of these goals have been ...