Semiconductor Engineering3d
The Rise Of Thin Wafer Processing
From thinning and trimming to bonding and debonding, 3D package quality is built on precise and extremely thin wafer ...
Intel is still using TSMC for 30% of its wafer demands: 'We were talking about trying to get that to zero as quickly as possible. That's no longer the strategy'
Intel's foundry business never seems far from the headlines these days, not least because various ex-executives continue to publicly debate whether it might be a good idea to split it from the rest of ...
PhoneArena1d
More details are leaked about the chip powering the new Huawei Pura X foldable
We now know more details about the Kirin 9020 application processor running the just announced Huawei Pura X foldable.
Siltronic: An Overvalued Bet On The Semiconductor Industry
Siltronic (SLTCY) faces profitability challenges due to cyclical market dynamics and lack of pricing power despite growth.
PhoneArena4d
Apple expected to make unusual decision about the A20 chips powering 2026's iPhone 18 line
Apple might stick to using TSMC's third-generation process node (N3P) for the A20 chips powering the iPhone 18 in 2026.