EurekAlert!5d
Overcoming stacking constraints in hexagonal boron nitride via metal-organic chemical vapor deposition
POSTECH and University of Montpellier researchers demonstrate wafer-scale AA-stacked hexagonal boron nitride (hBN) growth.
AZoM on MSN3d
Engineering Tailored Configurations in van der Waals Materials
Pohang University and University of Montpellier researchers synthesize AA-stacked hBN, revealing novel stacking control ...
Corning Incorporated (GLW) Investor Event Conference Call (Transcript)
Corning Incorporated ( NYSE: GLW) Investor Event Conference Call March 18, 2025 8:45 AM ET ...
Semiconductor Engineering5d
The Rise Of Thin Wafer Processing
From thinning and trimming to bonding and debonding, 3D package quality is built on precise and extremely thin wafer ...
Keysight to Demonstrate AI Innovations at OFC 2025
Join Keysight experts for the following demonstrations featuring the latest innovations in optical transmission and data ...
Tower Semiconductor and Alcyon Photonics Announce Collaboration to Accelerate Integrated Photonics Innovation
Providing Silicon-Validated Photonics IP Based on Tower's SiPho Platform for Datacom, Telecom and Sensing Markets MIGDAL HAEMEK, Israel, and ...
Semiconductor Engineering14h
Defect Analysis and Testing Framework For FOWLP Interconnects
A new technical paper titled “Defect Analysis and Built-In-Self-Test for Chiplet Interconnects in Fan-out Wafer-Level ...