From thinning and trimming to bonding and debonding, 3D package quality is built on precise and extremely thin wafer ...

Micromachining silicon with lasers (but no sharks)! Today we're exploring different properties and parameters involved with cutting silicon with a pulsed nanosecond laser Greenland forms new unity ...

Furthermore, processing silicon wafers in the US is just slightly more expensive than in Asia, according to the study. TechInsights crunched some numbers about TSMC through its Semiconductor ...

The Silicon Quantum Group has submitted a new pre-print by PhD student Michael Dobinson. In their paper, “Electrically-triggered spin-photon devices in silicon”, they show a new electrical control ...

ISO 26262 is a standard related to the safety of electrical and electronic systems within a car and addresses possible hazards caused by malfunctioning behavior of safety-related systems, including ...

Today, a new path has been announced, with signed deals among Corning, Suniva and Heliene. Corning will make silicon wafers in Michigan using polysilicon from nearby Hemlock Semiconductor, of which ...

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Traditionally, surface mounting components on double-sided printed circuit boards (PCBs) requires adhesive on at least one side to keep the components in place during ... January 6, 2025 AI Technology ...

The surface of the electrodes was then inspected under a microscope to verify the quality and uniformity ... characterization of the standard silicon-based neural probe before and after black Pt ...

The BitCsi2Rx IP is a receiver for camera sensor signals, to be used in an FPGA or ASIC. It receives camera signals in accordance with the MIPI CSI-2 and D-PHY specifications. BitCsi2Rx converts ...