In recent years semiconductor research papers prominently featured several key subjects driven by technological advancements and industry demands. Generative AI and high-performance computing (HPC) ...
Tower Semiconductor has used OpenLight Photonics' 200G heterogeneous modulator design IP to demonstrate 400G/lane modulator on Tower’s commercially available, integrated silicon photonics platform, ...
RF and Opto semiconductor device specialist MACOM Announced introduction of high power capable new optical amplifier devices to amplify light signals so that they are powerful enough to travel longer ...
Cadence has announced launch of AI powered EDA tool-suite Conformal AI Studio to address the Semiconductor chip design industry requirement of higher productivity and quick turnout of complex designs ...
NVIDIA’s GTC 2025 conference kicked off this week, spotlighting the latest advancements in artificial intelligence (AI) and semiconductor technology. From groundbreaking GPU architectures to visionary ...
Ambarella unveiled N1-655 edge GenAI system-on-chip (SoC), which provides on-chip decode of 12x simultaneous 1080p30 video streams, while concurrently processing that video and running a hybrid of ...
Applied Materials announced introduction of world's most advanced new defect review system SEMVision H20 featuring electron beam (eBeam) technology with advanced AI image recognition. This tool can ...
Open Compute Project Foundation (OCP) and JEDEC Solid State Technology Association announce the availability of new Chiplet Design Kits for use with today's EDA tools covering Assembly, Substrate, ...
Sachin Tendulkar invested RRP Electronics has formed strategic alliance with US-based Deca Technologies, where RRP to integrate Deca’s innovative Wafer-Level Chip Scale Packaging (WLCSP) and M-Series ...
MaxLinear showcases Sierra radio SoC linearization performance as a complete Open RAN Radio Unit (O-RU) solution at MWC 2025. MaxLinear is highlighting the chip enables radio vendors to rapidly and ...
If you wish to send any news/press releases or design article related to electronics/semiconductor design to publish in EE Herald, email it to [email protected]. We ...
Teledyne LeCroy has introduced the Summit M64, a PCI Express (PCIe) protocol analyzer/exerciser to their product lineup. This cutting-edge system captures and generates PCIe 6.x, CXL 3.x, and NVMe 2.x ...
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